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Erico LPC533 Crimp Bonding Plate; 63.5 mm Width x 88.65 mm Depth x 1.63 mm Height, Copper
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Product Details
Detailed Description:
Erico Crimp bonding plate with 51.61 Sq.cm contact area, has copper construction. It measures 1.63 mm x 63.5 mm x 88.65 mm. The compression type fingers crimp over cable for direct contact. Plate is UL listed.
Product Specification
| Application | Grounding and Bonding; Lightning Protection |
| Brand | nVent ERICO |
| Catalog Description | Crimp Bonding Plate, Copper, 8 in¦ Min Contact Area |
| GTIN |
00782856429845 |
| Item Status | K |
| Material | Copper |
| Mfr. # | LPC533 |
| Type | Bonding Plates |
| UNSPSC | 39121621 |
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